TVHSAC

3rd IEEE International Workshop on
Test and Validation of High Speed Analog Circuits
Disneyland Hotel, Anaheim, California, USA

September 12-13, 2013

Held in conjunction with IEEE International Test Conference 2013

General Chair
Amit Majumdar, Xilinx

Vice General Chair
Yervant Zorian, Synopsys

Program Chair
Haralampos Stratigopoulos, TIMA

Finance
Chen-Huan Chiang, Alcatel-Lucent

Local Arrangements
Sandeep Gupta, USC

Program Committee (to include)
Jacob A. Abraham, UT Austin
Elad Alon, UC Berkeley
Florence Azais, LIRMM
Tapan Chakrabarty, Qualcomm
Abhijit Chatterjee, Georgia Tech
K. T. Tim Cheng, UCSB
Jerzy Dabrowski, Linkoping Univ.
William R. Eisenstadt, Univ. Florida
Oren Eliezer, Xtendwave
Christophe Erdmann, Xilinx
Yohan Frans, Xilinx
Abhilash Goyal, Oracle
David Keezer, Georgia Tech
Haruo Kobayashi, Gunma Univ.
Hervé Le-Gall, STMicroelectronics
Yiorgos Makris, UT Dallas
Cedric Mayor, Presto Engineering
Navraj Nandra, Synopsys
Suriyaprakash Natarajan, Intel
Sule Ozev, Arizona State Univ.
Gordon Roberts, McGill Univ.
Shreyas Sen, Intel
Saghir Shaikh, Broadcom
Mustafa Slamani, IBM
Stephen Sunter, Mentor Graphics
Gin Yee, AMD
Ping-Ying Wang, MediaTek
Ender Yilmaz, Freescale
Vladimir Zivkovic, D4T Systems


For general information contact:
Amit Majumdar
Tel: +408-879-3097
Fax: +408-626-6499
E-mail: amit.majumdar AT xilinx DOT com

Call for Participation

Program

Scope

Demand for higher bandwidths never lets up in the world of communication and networks. While we struggle today to make 40Gbps line-rates a reality, plans are already afoot for 400Gbps. Similarly in wireless communications, 60Ghz is coming on-line today, but designers are already planning the next few generations up to Thz. What is high-speed? It clearly depends: on the medium of transmission, on power constraints, on process technology, on link parallelism, on cost and quality requirements and on the electrical and thermal environment of operation. These constraints define a multi-dimensional box that designers are placed in and asked to provide the highest bandwidth they can, inside a room whose walls seem constantly to move inwards. A lot of the functionality is increasingly analog with strict standards regulating their design and use. And it is a race with no end in sight.


The IEEE Workshop on Test and Validation of High Speed Analog Circuits is designed to address a big aspect of this race: cost and quality. Increasing speed has given rise to a spike in complexity of analog circuits. This has been further stressed by the need for integrating with digital functionality in SOCs. Whether embedding in monolithic dice or integrating in a SiP, integration has thrown its share of problems. Defect coverage alone is no longer sufficient to qualify a die. We need parametric coverage, as early in the manufacturing flow, as possible. This workshop addresses defect and parametric coverage of all analog circuits involved in making high bandwidth communications a reality. The scope of the workshop includes:

  • SERDES test and characterization
  • RF circuits test and characterization
  • Self-healing, self-calibration and self-adaptation techniques
  • Built-in test and design-for-test
  • High speed data converter test and characterization
  • 3D and KGD considerations.
  • High speed PLL test and characterization
  • Clock jitter and skew measurement
  • Phase noise measurement
  • Precision delay-line test and characterization
  • AC and DC supply noise measurement
  • Analog fault modeling and fault simulation
  • Analog test bus design
  • ATE technology
  • Board technology
  • Economics of test and yield optimization
Author information

Prospective authors are invited to submit extended summaries or full papers up to 6 pages. Proposals for special sessions, hot topics, and panel sessions are also invited. Submissions are due no later than July 1st, 2013. Submissions should be made by e-mail to

Amit Majumdar    E-mail: amit.majumdar AT xilinx DOT com  
Haralampos Stratigopoulos E-mail: haralampos.stratigopoulos AT imag DOT fr

Notification e-mails of acceptance will be sent by July 15th, 2013.

Authors of accepted papers, special sessions, hot topics, and panel sessions should submit final manuscripts by July 31, 2013 for inclusion in the Workshop Digest of Papers, which will be provided to the attendees.

 

 

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